Interposer and Fan-Out WLP Market Size, Growth Analysis Report and Future Forecast, 2032
In 2022, global sales revenue for interposer and fan-out Wafer Level Packaging (WLP) reached an impressive US$ 13.4 billion. Looking ahead to the period from 2022 to 2032, there is a projected surge in global demand for interposer and fan-out WLP at a remarkable Compound Annual Growth Rate (CAGR) of 22.6%. This substantial growth is expected to propel the worldwide market size for interposer and fan-out WLP to reach an estimated US$ 103 billion by the close of 2032.
The consumer electronics sector is anticipated to play a pivotal role in sustaining the high adoption of interposers and fan-out WLP. According to Persistence Market Research (PMR), this segment is poised to advance at a CAGR of 22.3% from 2022 to 2032, solidifying its position as a key revenue-generating segment for companies...